JPS6329398B2 - - Google Patents
Info
- Publication number
- JPS6329398B2 JPS6329398B2 JP59195237A JP19523784A JPS6329398B2 JP S6329398 B2 JPS6329398 B2 JP S6329398B2 JP 59195237 A JP59195237 A JP 59195237A JP 19523784 A JP19523784 A JP 19523784A JP S6329398 B2 JPS6329398 B2 JP S6329398B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- sin
- sion
- dielectric layer
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010408 film Substances 0.000 claims description 45
- 238000004544 sputter deposition Methods 0.000 claims description 15
- 239000010409 thin film Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 238000005268 plasma chemical vapour deposition Methods 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 43
- 238000000034 method Methods 0.000 description 13
- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 238000000137 annealing Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 239000012495 reaction gas Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59195237A JPS6174293A (ja) | 1984-09-17 | 1984-09-17 | 薄膜el素子の製造方法 |
US07/246,890 US4880661A (en) | 1984-09-17 | 1988-09-15 | Method of manufacturing a thin-film electroluminescent display element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59195237A JPS6174293A (ja) | 1984-09-17 | 1984-09-17 | 薄膜el素子の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6174293A JPS6174293A (ja) | 1986-04-16 |
JPS6329398B2 true JPS6329398B2 (en]) | 1988-06-13 |
Family
ID=16337762
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59195237A Granted JPS6174293A (ja) | 1984-09-17 | 1984-09-17 | 薄膜el素子の製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US4880661A (en]) |
JP (1) | JPS6174293A (en]) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0752673B2 (ja) * | 1989-01-18 | 1995-06-05 | シャープ株式会社 | 薄膜el素子 |
JPH0825305B2 (ja) * | 1989-04-17 | 1996-03-13 | 株式会社テック | 端面発光型el素子アレイの製作方法 |
US5264714A (en) * | 1989-06-23 | 1993-11-23 | Sharp Kabushiki Kaisha | Thin-film electroluminescence device |
JP2703809B2 (ja) * | 1989-08-28 | 1998-01-26 | シャープ株式会社 | 薄膜el素子の製造方法 |
DE69431573T2 (de) * | 1993-07-28 | 2003-06-12 | Asahi Glass Co., Ltd. | Verfahren zur Herstellung von Schichten |
JPH0917572A (ja) * | 1995-06-26 | 1997-01-17 | Hewlett Packard Co <Hp> | 薄膜エレクトロルミネセンス素子のシール形成方法及びエレクトロルミネセンス素子 |
US6624569B1 (en) | 1999-12-20 | 2003-09-23 | Morgan Adhesives Company | Electroluminescent labels |
US6621212B1 (en) | 1999-12-20 | 2003-09-16 | Morgan Adhesives Company | Electroluminescent lamp structure |
US6639355B1 (en) | 1999-12-20 | 2003-10-28 | Morgan Adhesives Company | Multidirectional electroluminescent lamp structures |
JP2003221257A (ja) * | 2002-01-31 | 2003-08-05 | Nippon Sheet Glass Co Ltd | 透明薄膜の成形方法およびそれを備える透明基体 |
US6922020B2 (en) | 2002-06-19 | 2005-07-26 | Morgan Adhesives Company | Electroluminescent lamp module and processing method |
CN100469203C (zh) * | 2002-09-12 | 2009-03-11 | 伊菲雷知识产权公司 | 用于电致发光显示器的氧氮化硅钝化的稀土激活硫代铝酸盐磷光体 |
TWI370700B (en) * | 2003-03-31 | 2012-08-11 | Dainippon Printing Co Ltd | Protective coat and method for manufacturing thereof |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4188565A (en) * | 1977-09-16 | 1980-02-12 | Sharp Kabushiki Kaisha | Oxygen atom containing film for a thin-film electroluminescent element |
JPS6029295B2 (ja) * | 1979-08-16 | 1985-07-10 | 舜平 山崎 | 非単結晶被膜形成法 |
US4517733A (en) * | 1981-01-06 | 1985-05-21 | Fuji Xerox Co., Ltd. | Process for fabricating thin film image pick-up element |
JPH0635323B2 (ja) * | 1982-06-25 | 1994-05-11 | 株式会社日立製作所 | 表面処理方法 |
US4525381A (en) * | 1983-02-09 | 1985-06-25 | Ushio Denki Kabushiki Kaisha | Photochemical vapor deposition apparatus |
JPS59179152A (ja) * | 1983-03-31 | 1984-10-11 | Agency Of Ind Science & Technol | アモルファスシリコン半導体薄膜の製造方法 |
-
1984
- 1984-09-17 JP JP59195237A patent/JPS6174293A/ja active Granted
-
1988
- 1988-09-15 US US07/246,890 patent/US4880661A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4880661A (en) | 1989-11-14 |
JPS6174293A (ja) | 1986-04-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |